Chris Johnson
26Patents
6h-index
21Co-inventors
69Inventor score
Filing activity: May 31, 1995 → Apr 11, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9993166B1 | Monitoring device using radar and measuring motion with a non-contact device | Human Necessities | 45 | Active |
| US8785332B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 14 | Active |
| US8802545B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 11 | Active |
| US8691702B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 8 | Active |
| US5509031A | Method of transmitting and receiving encoded data in a radio communication system | Electricity | 8 | Expired |
| US8778806B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 7 | Active |
| US9711406B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 5 | Active |
| US9070760B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 2 | Active |
| US8796154B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US9343365B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US6542274B1 | Method and apparatus for recovering an optical clock signal | Electricity | 1 | Expired |
| US9105705B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US9911654B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US9496177B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US10297427B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9564366B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US11488865B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US10707060B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9202721B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US10741447B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US9202720B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| USRE46339E1 | Method and apparatus for plasma dicing a semi-conductor wafer | General | 0 | Active |
| US10472917B2 | SBOP swarf wiper | Emerging Cross-Sectional Technologies | 0 | Active |
| US8980764B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US10573557B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.