Chun-Deuk Lee
7Patents
3h-index
17Co-inventors
50Inventor score
Filing activity: Mar 4, 1998 → Jun 30, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6159646A | Rework method utilizing thinner for wafers in manufacturing of semiconductor devices | Physics | 12 | Expired |
| US6010637A | Method and apparatus for preparing a sample for optical analysis and method of controlling the apparatus | Electricity | 5 | Expired |
| US6207358A | Method of stripping a photoresist from a semiconductor substrate using dimethylacetamide or a combination of monoethanolamine and dimethylsulfoxide | Physics | 4 | Expired |
| US7851372B2 | Composition for removing an insulation material, method of removing an insulation layer and method of recycling a substrate using the same | Electricity | 2 | Active |
| US6337174B1 | Method of stripping a photoresist from a semiconductor substrate dimethylacetamide or a combination of monoethanolamine and dimethylsulfoxide | Physics | 2 | Expired |
| US7842623B2 | Composition for removing an insulation material and related methods | Electricity | 0 | Active |
| US7566666B2 | Composition for removing an insulation material and related methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.