Chunming Zhou
8Patents
1h-index
23Co-inventors
47Inventor score
Filing activity: Dec 21, 2010 → Jun 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8431033B2 | High density plasma etchback process for advanced metallization applications | Electricity | 7 | Active |
| US11469096B2 | Method and chamber for backside physical vapor deposition | Electricity | 1 | Active |
| US11572618B2 | Method and chamber for backside physical vapor deposition | Electricity | 1 | Active |
| US12191198B2 | Low resistivity tungsten film and method of manufacture | Electricity | 0 | Active |
| US12094773B2 | Methods for low resistivity and stress tungsten gap fill | Electricity | 0 | Active |
| US12176205B2 | Method and chamber for backside physical vapor deposition | Electricity | 0 | Active |
| US11798845B2 | Methods and apparatus for low resistivity and stress tungsten gap fill | Electricity | 0 | Active |
| US12142478B2 | Method and chamber for backside physical vapor deposition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.