David G. Wontor
7Patents
5h-index
15Co-inventors
52Inventor score
Filing activity: Apr 18, 2003 → May 21, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6838776B2 | Circuit device with at least partial packaging and method for forming | Electricity | 237 | Expired |
| US6921975B2 | Circuit device with at least partial packaging, exposed active surface and a voltage reference plane | Electricity | 188 | Expired |
| US7361987B2 | Circuit device with at least partial packaging and method for forming | Electricity | 61 | Active |
| US7622309B2 | Mechanical integrity evaluation of low-k devices with bump shear | Electricity | 12 | Active |
| US7247552B2 | Integrated circuit having structural support for a flip-chip interconnect pad and method therefor | Electricity | 8 | Expired |
| US8053349B2 | BGA package with traces for plating pads under the chip | Electricity | 3 | Active |
| US8072062B2 | Circuit device with at least partial packaging and method for forming | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.