Devika Sil
6Patents
1h-index
24Co-inventors
40Inventor score
Filing activity: Jan 18, 2019 → Aug 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11114606B2 | MRAM devices containing a harden gap fill dielectric material | Electricity | 4 | Active |
| US11309216B2 | Large grain copper interconnect lines for MRAM | Electricity | 1 | Active |
| US11756786B2 | Forming high carbon content flowable dielectric film with low processing damage | Electricity | 0 | Active |
| US11302637B2 | Interconnects including dual-metal vias | Electricity | 0 | Active |
| US10978342B2 | Interconnect with self-forming wrap-all-around barrier layer | Electricity | 0 | Active |
| US12272545B2 | Embedded metal contamination removal from BEOL wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.