Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
US5283104A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1991 |
| Grant date | Feb 1, 1994 |
| Priority date | — |
| Expiry date | Mar 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.