Eric Guiot
10Patents
3h-index
18Co-inventors
53Inventor score
Filing activity: Nov 9, 2004 → Oct 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9954139B2 | Multiple transfer assembly process | Emerging Cross-Sectional Technologies | 3 | Active |
| US7217639B2 | Method of manufacturing a material compound wafer | Electricity | 3 | Expired |
| US8324072B2 | Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure | Electricity | 3 | Active |
| US9136113B2 | Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type | Electricity | 1 | Active |
| US12198983B2 | Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC | Electricity | 0 | Active |
| US8343850B2 | Process for fabricating a substrate comprising a deposited buried oxide layer | Electricity | 0 | Active |
| US11251321B2 | Engineered substrate with embedded mirror | Emerging Cross-Sectional Technologies | 0 | Active |
| US7256103B2 | Method for manufacturing a compound material wafer | Electricity | 0 | Expired |
| US10361326B2 | Advanced CPV solar cell assembly process | Emerging Cross-Sectional Technologies | 0 | Active |
| US12270123B2 | Method for producing a substrate for the epitaxial growth of a layer of a galium-based III-N alloy | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.