Gerald Beyer
10Patents
5h-index
13Co-inventors
63Inventor score
Filing activity: Mar 24, 1999 → Nov 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7319274B2 | Methods for selective integration of airgaps and devices made by such methods | Electricity | 24 | Expired |
| US7078352B2 | Methods for selective integration of airgaps and devices made by such methods | Electricity | 19 | Expired |
| US7037851B2 | Methods for selective integration of airgaps and devices made by such methods | Electricity | 17 | Expired |
| US7452812B2 | Method to create super secondary grain growth in narrow trenches | Electricity | 13 | Active |
| US10886252B2 | Method of bonding semiconductor substrates | Electricity | 6 | Active |
| US7745935B2 | Method to create super secondary grain growth in narrow trenches | Electricity | 1 | Active |
| US6245653A | Method of filling an opening in an insulating layer | Electricity | 1 | Expired |
| US10141284B2 | Method of bonding semiconductor substrates | Electricity | 0 | Active |
| US11810892B2 | Method of direct bonding semiconductor components | Electricity | 0 | Active |
| US7560357B2 | Method for creating narrow trenches in dielectric materials | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.