Greg Dix
8Patents
1h-index
12Co-inventors
44Inventor score
Filing activity: Mar 25, 2004 → Oct 15, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6987300B2 | High voltage ESD-protection structure | Electricity | 4 | Expired |
| US9812380B2 | Bumps bonds formed as metal line interconnects in a semiconductor device | Electricity | 1 | Active |
| US11495657B2 | Thin film resistor (TFR) formed in an integrated circuit device using an oxide cap layer as a TFR etch hardmask | Electricity | 0 | Active |
| US10326013B2 | Method of forming a field-effect transistor (FET) or other semiconductor device with front-side source and drain contacts | Electricity | 0 | Active |
| US10217810B2 | Capacitor formed on heavily doped substrate | Electricity | 0 | Active |
| US7170136B2 | High voltage ESD-protection structure | Electricity | 0 | Expired |
| US10753964B2 | Current sensing for integrated circuit devices | Electricity | 0 | Active |
| US9634135B2 | Power field effect transistor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.