Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability

US11289312B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Adolph Miller Allen · Oakland, US
• Vanessa Faune · San Jose, US
• Zhong Qiang Hua · San Jose, US
• Kirankumar Neelasandra SAVANDAIAH · Bengaluru, IN
• Anantha K. Subramani · San Jose, US
• Philip Allan Kraus · San Jose, US
• Tza-Jing Gung · San Jose, US
• Lei Zhou · Tianjin, CN
• Halbert Chong · San Jose, US
• Vaibhav Soni · Austin, US
• Kishor Kalathiparambil · Santa Clara, US

Key dates

• Filing date: Jun 12, 2019
• Grant date: Mar 29, 2022
• Expiry date: Jun 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3497
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.