Inventor · Hsinchu, TW

Han-Wei Yang

17Patents

3h-index

11Co-inventors

49Inventor score

Filing activity: Jun 28, 2013 → Dec 6, 2019

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9076804B2	Systems and methods to enhance passivation integrity	Electricity	6	Active
US9349688B2	Systems and methods to enhance passivation integrity	Electricity	4	Active
US9070687B2	Semiconductor device with self-protecting fuse	Electricity	3	Active
US9761486B2	Method of chip packaging	Electricity	2	Active
US10014251B2	Semiconductor device with self-protecting fuse and method of fabricating the same	Electricity	0	Active
US10157810B2	Systems and methods to enhance passivation integrity	Electricity	0	Active
US10204843B2	Interconnect arrangement with stress-reducing structure and method of fabricating the same	Electricity	0	Active
US9406559B2	Semiconductor structure and method for forming the same	Electricity	0	Active
US9472508B2	Interconnect arrangement with stress-reducing structure and method of fabricating the same	Electricity	0	Active
US10777480B2	Systems and methods to enhance passivation integrity	Electricity	0	Active
US9299621B2	Smart measurement techniques to enhance inline process control stability	Electricity	0	Active
US9818666B2	Interconnect arrangement with stress-reducing structure and method of fabricating the same	Electricity	0	Active
US10515866B2	Systems and methods to enhance passivation integrity	Electricity	0	Active
US9773716B2	Systems and methods to enhance passivation integrity	Electricity	0	Active
US9252047B2	Interconnect arrangement with stress-reducing structure and method of fabricating the same	Electricity	0	Active
US9093373B2	Conductive diffusion barrier structure for ohmic contacts	Electricity	0	Active
US9299658B2	Semiconductor device with self-protecting fuse and method of fabricating the same	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.