Hidetaka Oshio
8Patents
2h-index
23Co-inventors
40Inventor score
Filing activity: Nov 13, 2018 → Oct 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10727059B2 | Highly etch selective amorphous carbon film | Electricity | 3 | Active |
| US11527408B2 | Multiple spacer patterning schemes | Electricity | 2 | Active |
| US11469107B2 | Highly etch selective amorphous carbon film | Electricity | 2 | Active |
| US11145509B2 | Method for forming and patterning a layer and/or substrate | Electricity | 1 | Active |
| US12112949B2 | Highly etch selective amorphous carbon film | Electricity | 0 | Active |
| US12183578B2 | Method for forming and patterning a layer and/or substrate | Electricity | 0 | Active |
| US12014927B2 | Highly etch selective amorphous carbon film | Electricity | 0 | Active |
| US11315787B2 | Multiple spacer patterning schemes | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.