Hyo-Dong Ban
15Patents
6h-index
24Co-inventors
66Inventor score
Filing activity: Oct 30, 1997 → Dec 4, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6566735B1 | Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film | Electricity | 23 | Expired |
| US6589837B1 | Buried contact structure in semiconductor device and method of making the same | Electricity | 22 | Expired |
| US6448113B2 | Method of forming fuse area structure including protection film on sidewall of fuse opening in semiconductor device | Electricity | 17 | Expired |
| US6071802A | Method for manufacturing semiconductor device having self-aligned contact | Electricity | 15 | Expired |
| US8928073B2 | Semiconductor devices including guard ring structures | Electricity | 8 | Active |
| US6555450B2 | Contact forming method for semiconductor device | Electricity | 7 | Expired |
| US7081389B2 | Semiconductor devices having dual capping layer patterns and methods of manufacturing the same | Electricity | 6 | Expired |
| US6316803A | Integrated circuit memory devices having self-aligned contact | Electricity | 6 | Expired |
| US6696353B2 | Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film | Electricity | 6 | Expired |
| US10886277B2 | Methods of manufacturing devices including a buried gate cell and a bit line structure including a thermal oxide buffer pattern | Electricity | 5 | Active |
| USRE46549E1 | Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film | General | 1 | Active |
| US7339223B2 | Semiconductor devices having dual capping layer patterns and methods of manufacturing the same | Electricity | 1 | Active |
| US6835998B2 | Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the same | Electricity | 0 | Expired |
| US7667331B2 | Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip | Emerging Cross-Sectional Technologies | 0 | Active |
| US11574912B2 | Memory devices and methods of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.