Insup Shin
7Patents
1h-index
16Co-inventors
40Inventor score
Filing activity: Jun 14, 2013 → Nov 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10361177B2 | Semiconductor package having a molding layer including a molding cavity and method of fabricating the same | Electricity | 4 | Active |
| US9009545B2 | Pulsed-latch based razor with 1-cycle error recovery scheme | Physics | 0 | Active |
| US11756935B2 | Chip-stacked semiconductor package with increased package reliability | Electricity | 0 | Active |
| US12230575B2 | Carrier structure including pockets for accommodating semiconductor chip stack structure | Electricity | 0 | Active |
| US9292390B2 | Pulsed-latch based razor with 1-cycle error recovery scheme | Physics | 0 | Active |
| US9715437B2 | Pulsed-latch based razor with 1-cycle error recovery scheme | Physics | 0 | Active |
| US11721601B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.