Jason P. Gill
17Patents
4h-index
29Co-inventors
56Inventor score
Filing activity: Jun 28, 2003 → Jun 3, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7397260B2 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Electricity | 167 | Expired |
| US7096450B2 | Enhancement of performance of a conductive wire in a multilayered substrate | Electricity | 22 | Expired |
| US7166904B2 | Structure and method for local resistor element in integrated circuit technology | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7830019B2 | Via bottom contact and method of manufacturing same | Electricity | 7 | Active |
| US7867897B2 | Low leakage metal-containing cap process using oxidation | Electricity | 3 | Active |
| US7388224B2 | Structure for determining thermal cycle reliability | Emerging Cross-Sectional Technologies | 3 | Active |
| US7098054B2 | Method and structure for determining thermal cycle reliability | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7500208B2 | Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime | Electricity | 2 | Active |
| US7585764B2 | VIA bottom contact and method of manufacturing same | Electricity | 2 | Active |
| US7598614B2 | Low leakage metal-containing cap process using oxidation | Electricity | 2 | Expired |
| US7639032B2 | Structure for monitoring stress-induced degradation of conductive interconnects | Electricity | 2 | Active |
| US7511378B2 | Enhancement of performance of a conductive wire in a multilayered substrate | Electricity | 0 | Active |
| US9287186B2 | Method and structure for determining thermal cycle reliability | Emerging Cross-Sectional Technologies | 0 | Active |
| US8480302B2 | Micro-electro-mechanical-system temperature sensor | Physics | 0 | Active |
| US7231617B2 | Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits | Electricity | 0 | Expired |
| US9443776B2 | Method and structure for determining thermal cycle reliability | Emerging Cross-Sectional Technologies | 0 | Active |
| US7692439B2 | Structure for modeling stress-induced degradation of conductive interconnects | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.