Method and structure for determining thermal cycle reliability
US7098054B2 · kind B2 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2004 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Jul 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.