Method and structure for determining thermal cycle reliability
US9443776B2 · kind B2 · utility
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Key dates
| Filing date | Jun 3, 2015 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Jun 3, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A test structure used to determine reliability performance includes a patterned metallization structure having multiple interfaces, which provide stress risers. A dielectric material surrounds the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.