Jon Robert Tetzloff
11Patents
4h-index
13Co-inventors
53Inventor score
Filing activity: Mar 11, 2004 → Nov 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7227183B2 | Polysilicon conductor width measurement for 3-dimensional FETs | Electricity | 195 | Expired |
| US7183780B2 | Electrical open/short contact alignment structure for active region vs. gate region | Electricity | 57 | Expired |
| US7241649B2 | FinFET body contact structure | Electricity | 16 | Expired |
| US7317605B2 | Method and apparatus for improving performance margin in logic paths | Physics | 7 | Expired |
| US7696565B2 | FinFET body contact structure | Electricity | 3 | Active |
| US8049526B2 | Enhanced speed sorting of microprocessors at wafer test | Physics | 1 | Active |
| US7336086B2 | Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure | Electricity | 0 | Active |
| US11422611B2 | Adaptive frequency optimization in processors | Emerging Cross-Sectional Technologies | 0 | Active |
| US7659733B2 | Electrical open/short contact alignment structure for active region vs. gate region | Electricity | 0 | Active |
| US10509457B2 | Adaptive frequency optimization in processors | Emerging Cross-Sectional Technologies | 0 | Active |
| US7453272B2 | Electrical open/short contact alignment structure for active region vs. gate region | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.