Junyun Kweon
7Patents
1h-index
13Co-inventors
37Inventor score
Filing activity: Mar 23, 2021 → Sep 18, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11798872B2 | Interconnection structure and semiconductor package including the same | Electricity | 1 | Active |
| US12412824B2 | Semiconductor packages and methods of forming the same | Electricity | 0 | Active |
| US12347760B2 | Interconnection structure and semiconductor package including the same | Electricity | 0 | Active |
| US11854893B2 | Method of manufacturing semiconductor package | Electricity | 0 | Active |
| US11923309B2 | Semiconductor package including fine redistribution patterns | Electricity | 0 | Active |
| US12009288B2 | Interconnection structure and semiconductor package including the same | Electricity | 0 | Active |
| US12224256B2 | Wafer structure and semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.