Karan Kacker
9Patents
3h-index
11Co-inventors
46Inventor score
Filing activity: May 24, 2007 → Apr 3, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8522430B2 | Clustered stacked vias for reliable electronic substrates | Emerging Cross-Sectional Technologies | 32 | Active |
| US8242593B2 | Clustered stacked vias for reliable electronic substrates | Emerging Cross-Sectional Technologies | 4 | Active |
| US10591979B2 | Battery management in a device with multiple batteries | Emerging Cross-Sectional Technologies | 4 | Active |
| US8766449B2 | Variable interconnect geometry for electronic packages and fabrication methods | Emerging Cross-Sectional Technologies | 1 | Active |
| US8382489B2 | Compliant off-chip interconnects for use in electronic packages and fabrication methods | Emerging Cross-Sectional Technologies | 1 | Active |
| US8206160B2 | Compliant off-chip interconnects for use in electronic packages | Emerging Cross-Sectional Technologies | 1 | Active |
| US8866026B2 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Emerging Cross-Sectional Technologies | 0 | Active |
| US9099458B2 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Emerging Cross-Sectional Technologies | 0 | Active |
| US8258410B2 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.