Inventor · Boise, ID, US

Keith E. Ypma

10Patents
3h-index
18Co-inventors
49Inventor score

Filing activity: May 19, 2014 → Mar 3, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9748128B1 Systems and methods for wafer alignment Performing Operations; Transporting 11 Active
US9299663B2 Semiconductor devices and methods for backside photo alignment Electricity 9 Active
US10062595B2 Systems and methods for wafer alignment Performing Operations; Transporting 3 Active
US9754895B1 Methods of forming semiconductor devices including determining misregistration between semiconductor levels and related apparatuses Electricity 3 Active
US10242901B2 Systems and methods for wafer alignment Performing Operations; Transporting 2 Active
US10347519B2 Systems and methods for wafer alignment Performing Operations; Transporting 1 Active
US9741612B2 Semiconductor devices and methods for backside photo alignment Electricity 1 Active
US12195867B2 Electrochemical deposition systems with enhanced crystallization prevention features Chemistry; Metallurgy 0 Active
US12146235B2 Plating and deplating currents for material co-planarity in semiconductor plating processes Electricity 0 Active
US10600667B2 Systems and methods for wafer alignment Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.