Lawrence Lin
8Patents
5h-index
24Co-inventors
63Inventor score
Filing activity: Jan 15, 1979 → Mar 3, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5565376A | Device isolation technology by liquid phase deposition | Electricity | 23 | Expired |
| US5449638A | Process on thickness control for silicon-on-insulator technology | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7767570B2 | Dummy vias for damascene process | Electricity | 8 | Active |
| US4721682A | Isolation and substrate connection for a bipolar integrated circuit | Electricity | 6 | Expired |
| US7960821B2 | Dummy vias for damascene process | Electricity | 6 | Active |
| US7226873B2 | Method of improving via filling uniformity in isolated and dense via-pattern regions | Electricity | 5 | Expired |
| US6833318B2 | Gap-filling process | Electricity | 5 | Expired |
| US4228578A | Method for off-orientation point rotation sawing of crystalline rod material | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.