Ming He
7Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Mar 23, 2018 → Aug 5, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10672982B1 | Fabrication of correlated electron material (CEM) devices | Electricity | 3 | Active |
| US10566527B2 | Method for fabrication of a CEM device | Electricity | 1 | Active |
| US10854811B2 | Formation of correlated electron material (CEM) devices with restored sidewall regions | Electricity | 1 | Active |
| US10833271B2 | Method for fabrication of a CEM device | Electricity | 0 | Active |
| US11075339B2 | Correlated electron material (CEM) devices with contact region sidewall insulation | Electricity | 0 | Active |
| US11528830B2 | Adhesion structure and electronic device | Chemistry; Metallurgy | 0 | Active |
| US10881025B1 | Elastic heat-dissipation structure and electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.