Pak Leung
6Patents
3h-index
15Co-inventors
50Inventor score
Filing activity: Jun 23, 1995 → Aug 30, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD369163S | Telephone set | General | 26 | Expired |
| US7790601B1 | Forming interconnects with air gaps | Electricity | 18 | Active |
| US9018089B2 | Multiple step anneal method and semiconductor formed by multiple step anneal | Electricity | 6 | Active |
| US7188321B2 | Generation of metal holes by via mutation | Electricity | 2 | Expired |
| US7875544B2 | Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation | Electricity | 1 | Active |
| US8378493B2 | Generation of metal holes by via mutation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.