Electro-chemical deposition system
US7497932B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2006 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Jun 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.