Prabhakar P. Tripathi
9Patents
6h-index
13Co-inventors
56Inventor score
Filing activity: Jul 19, 1991 → Oct 3, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6109775A | Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon | Electricity | 31 | Expired |
| US5776831A | Method of forming a high electromigration resistant metallization system | Electricity | 23 | Expired |
| US5477466A | Method and structure for improving patterning design for processing | Electricity | 10 | Expired |
| US5379233A | Method and structure for improving patterning design for processing | Electricity | 9 | Expired |
| US6664141B1 | Method of forming metal fuses in CMOS processes with copper interconnect | Electricity | 8 | Expired |
| US5654897A | Method and structure for improving patterning design for processing | Electricity | 7 | Expired |
| US6828653B1 | Method of forming metal fuses in CMOS processes with copper interconnect | Electricity | 5 | Expired |
| US6569751B1 | Low via resistance system | Electricity | 4 | Expired |
| US6893962B2 | Low via resistance system | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.