Sonarith Chhun
9Patents
2h-index
13Co-inventors
44Inventor score
Filing activity: Feb 13, 2007 → Dec 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10892291B2 | Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection | Electricity | 17 | Active |
| US10910428B2 | Electronic device image sensor | Electricity | 3 | Active |
| US8143157B2 | Fabrication of a diffusion barrier cap on copper containing conductive elements | Electricity | 1 | Active |
| US8424177B2 | MIM capacitor with enhanced capacitance | Emerging Cross-Sectional Technologies | 1 | Active |
| US7989342B2 | Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientations | Electricity | 0 | Active |
| US11682689B2 | Electronic device image sensor | Electricity | 0 | Active |
| US11978756B2 | Electronic device image sensor | Electricity | 0 | Active |
| US9876032B2 | Method of manufacturing a device with MOS transistors | Electricity | 0 | Active |
| US7630191B2 | MIM capacitor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.