Tsung-Chieh Chen
9Patents
6h-index
9Co-inventors
52Inventor score
Filing activity: Sep 5, 1998 → Jul 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6215180A | Dual-sided heat dissipating structure for integrated circuit package | Electricity | 89 | Expired |
| US6077724A | Multi-chips semiconductor package and fabrication method | Electricity | 74 | Expired |
| US6130477A | Thin enhanced TAB BGA package having improved heat dissipation | Electricity | 32 | Expired |
| US6245598A | Method for wire bonding a chip to a substrate with recessed bond pads and devices formed | Electricity | 19 | Expired |
| US6448110B1 | Method for fabricating a dual-chip package and package formed | Electricity | 14 | Expired |
| US6492196B1 | Packaging process for wafer level IC device | Electricity | 9 | Expired |
| US6075281A | Modified lead finger for wire bonding | Electricity | 6 | Expired |
| US6160311A | Enhanced heat dissipating chip scale package method and devices | Electricity | 4 | Expired |
| US10331789B2 | Semantic analysis apparatus, method, and non-transitory computer readable storage medium thereof | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.