Semiconductor device including a LDMOS transistor, monolithic microwave integrated circuit and method
US10020270B2 · kind B2 · utility
0Cited by
16References
20Claims
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Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Sep 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a semiconductor device includes a semiconductor substrate including a front surface, an LDMOS transistor structure in the front surface, a conductive interconnection structure arranged on the front surface, and at least one cavity arranged in the front surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.