Semiconductor device including a LDMOS transistor and method
US10050139B2 · kind B2 · utility
0Cited by
17References
14Claims
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Key dates
| Filing date | Jun 24, 2016 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jun 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a LDMOS transistor in the front surface, and a metallization structure arranged on the front surface. The metallization structure includes at least one cavity arranged in at least one dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.