Ale smoothness: in and outside semiconductor industry
US10304659B2 · kind B2 · utility
4Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Apr 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of etching and smoothening films by exposing to a halogen-containing plasma and an inert plasma within a bias window in cycles are provided. Methods are suitable for etching and smoothening films of various materials in the semiconductor industry and are also applicable to applications in optics and other industries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.