Printed chemical mechanical polishing pad

US10322491B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mahendra C. ORILALL · Downingtown, US
• Timothy Michaelson · Austin, US
• Kasiraman Krishnan · Clifton Park, US
• Rajeev Bajaj · Fremont, US
• Nag B. Patibandla · Pleasanton, US
• Daniel Redfield · معلمی نژاد, US
• Fred C. Redeker · Fremont, US
• Gregory E. Menk · Pleasanton, US

Key dates

• Filing date: Oct 16, 2015
• Grant date: Jun 18, 2019
• Expiry date: Oct 16, 2035

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B33Y80/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.