Integrated cluster tool for selective area deposition

US10358715B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Tobin Kaufman-Osborn · Sunnyvale, US
• Srinivas D. Nemani · Sunnyvale, US
• Ludovic Godet · Sunnyvale, US
• Qiwei Liang · Fremont, US
• Adib Khan · Santa Clara, US

Key dates

• Filing date: Jun 3, 2016
• Grant date: Jul 23, 2019
• Expiry date: Jun 3, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/038
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein relate to apparatus and methods for processing a substrate. In one embodiment, a cluster tool apparatus is provided having a transfer chamber and a pre-clean chamber, a self-assembled monolayer (SAM) deposition chamber, an atomic layer deposition (ALD) chamber, and a post-processing chamber disposed about the transfer chamber. A substrate may be processed by the cluster tool and transferred between the pre-clean chamber, the SAM deposition chamber, the ALD chamber, and the post-processing chamber. Transfer of the substrate between each of the chambers may be facilitated by the transfer chamber which houses a transfer robot.