Apparatus for controlling temperature uniformity of a substrate
US10386126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2016 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Apr 19, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/001
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus for controlling the thermal uniformity of a substrate can control the thermal uniformity of the substrate to be more uniform or to be non-uniform. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon. A flow path is disposed within the substrate support to flow a heat transfer fluid beneath the support surface. The flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length. The first portion is spaced about 2 mm to about 10 mm from the second portion. The first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.