Porous chemical mechanical polishing pads

US10456886B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sivapackia Ganapathiappan · Palo Alto, US
• Nag B. Patibandla · Pleasanton, US
• Rajeev Bajaj · Fremont, US
• Daniel Redfield · معلمی نژاد, US
• Fred C. Redeker · Fremont, US
• Mahendra C. ORILALL · Downingtown, US
• Boyi Fu · San Jose, US
• Mayu YAMAMURA · San Mateo, US
• Ashwin CHOCKALINGAM · San Jose, US

Key dates

• Filing date: Dec 29, 2016
• Grant date: Oct 29, 2019
• Expiry date: Dec 29, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B33Y80/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.