Patent · US Active

Techniques for combining CMP process tracking data with 3D printed CMP consumables

US10593574B2 · kind B2 · utility

17Cited by

13References

27Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Jason Garcheung Fung · Sunnyvale, US
Rajeev Bajaj · Fremont, US
Daniel Redfield · معلمی نژاد, US
Aniruddh Jagdish Khanna · Fremont, US
Mario CORNEJO · San Jose, US
Gregory E. Menk · Pleasanton, US
John E. Watkins · Sunnyvale, US

Key dates

Filing date	Nov 6, 2015
Grant date	Mar 17, 2020
Priority date	—
Expiry date	Jul 13, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/26
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.