System and method for substrate processing chambers

US10600624B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Kalyanjit Ghosh · Pleasanton, US
• Sanjeev Baluja · Campbell, US
• Mayur Govind Kulkarni · Sunnyvale, US
• Shailendra Srivastava · Fremont, US
• Tejas Ulavi · San Jose, US
• Yusheng Zhou · Sunnyvale, US
• Amit Kumar BANSAL · Milpitas, US
• Priyanka DASH · Menlo Park, US
• Zhijun Jiang · Sunnyvale, US
• Ganesh Balasubramanian · Sunnyvale, US
• Qiang Ma · Kunming, CN
• Kaushik Alayavalli · Sunnyvale, US
• Yuxing Zhang · Ottawa, CA
• Daniel HWUNG · Los Gatos, US
• Shawyon Jafari · Sunnyvale, US

Key dates

• Filing date: Dec 21, 2018
• Grant date: Mar 24, 2020
• Expiry date: Dec 21, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/3321
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Systems and methods for depositing a film in a PECVD chamber while reducing residue buildup in the chamber. In some embodiments disclosed herein, a processing chamber includes a chamber body, a substrate support, a showerhead, and one or more heaters configured to heat the showerhead. In some embodiments, the processing chamber includes a controller.