Patent · US Active

Chamfered replacement gate structures

US10636890B2 · kind B2 · utility

0Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 8, 2018
Grant dateApr 28, 2020
Priority date
Expiry dateMay 8, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76897
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to chamfered replacement gate structures and methods of manufacture. The structure includes: a recessed gate dielectric material in a trench structure; a plurality of recessed workfunction materials within the trench structure on the recessed gate dielectric material; a plurality of additional workfunction materials within the trench structure and located above the recessed gate dielectric material and the plurality of recessed workfunction materials; a gate metal within the trench structure and over the plurality of additional workfunction materials, the gate metal and the plurality of additional workfunction materials having a planar surface below a top surface of the trench structure; and a capping material over the gate metal and the plurality of additional workfunction materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.