Gas delivery module
US10748783B2 · kind B2 · utility
16Cited by
82References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2019 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Jul 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.