Composition for post chemical-mechanical-polishing cleaning

US10844333B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Christian Daeschlein · Bochum, DE
• Max Siebert · Ludwigshafen, DE
• Michael Lauter · Mannheim, DE
• Piotr Przybylski · Ludwigshafen, DE
• Julian Proelss · Allschwil, CH
• Andreas Klipp · Lambsheim, DE
• Haci Osman GUEVENC · Heidelberg, DE
• Leonardos Leunissen · Ludwigshafen, DE
• Roelf-Peter Baumann · Mannheim, DE
• Te Yu Wei · Taoyuan, TW

Key dates

• Filing date: Dec 20, 2016
• Grant date: Nov 24, 2020
• Expiry date: Dec 20, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more nonionic polymers selected from the group consisting of poly-acrylamides, polyhydroxyethyl(meth)acrylates (PHE(M)A), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polymers of formula (I), and mixtures thereof, wherein R1 is hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, or sec-butyl, R2 is hydrogen or methyl, and n is an integer, (B) poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.