Te Yu Wei
7Patents
1h-index
16Co-inventors
40Inventor score
Filing activity: Aug 9, 2016 → Sep 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10899945B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates | Electricity | 2 | Active |
| US12351737B2 | Chemical mechanical polishing of substrates containing copper and ruthenium | Electricity | 0 | Active |
| US11725117B2 | Chemical mechanical polishing of substrates containing copper and ruthenium | Chemistry; Metallurgy | 0 | Active |
| US10844325B2 | Composition for post chemical-mechanical-polishing cleaning | Chemistry; Metallurgy | 0 | Active |
| US11993729B2 | Chemical mechanical polishing composition | Electricity | 0 | Active |
| US10844333B2 | Composition for post chemical-mechanical-polishing cleaning | Chemistry; Metallurgy | 0 | Active |
| US12378439B2 | Compositions for tungsten etching inhibition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.