Composition for post chemical-mechanical-polishing cleaning

US10865361B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Christian Daeschlein · Bochum, DE
• Max Siebert · Ludwigshafen, DE
• Michael Lauter · Mannheim, DE
• Leonardus Leunissen · Ludwigshafen, DE
• Ivan Garcia Romero · Ludwigshafen, DE
• Haci Osman GUEVENC · Heidelberg, DE
• Peter Przybylski · Ludwigshafen, DE
• Julian Proelss · Allschwil, CH
• Andreas Klipp · Lambsheim, DE

Key dates

• Filing date: May 31, 2017
• Grant date: Dec 15, 2020
• Expiry date: Aug 18, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more water-soluble nonionic copolymers of the general formula (I) and mixtures thereof, formula (I) wherein R1 and R3 are independently from each other hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-Butyl, or sec-butyl, R2 is methyl and x and y are an integer, 1 (B)poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.