High temperature vapor delivery system and method

US10954594B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Viachslav Babayan · Sunnyvale, US
• Qiwei Liang · Fremont, US
• Tobin Kaufman-Osborn · Sunnyvale, US
• Ludovic Godet · Sunnyvale, US
• Srinivas D. Nemani · Sunnyvale, US

Key dates

• Filing date: Dec 2, 2015
• Grant date: Mar 23, 2021
• Expiry date: Jun 21, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68771
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure generally relate to a semiconductor processing apparatus. In one embodiment, a processing chamber is disclosed herein. The processing chamber includes a chamber body and lid defining an interior volume, the lid configured to support a housing having a cap, a substrate support disposed in the interior volume, a vaporizer coupled to the cap and having an outlet open to the interior volume of the processing chamber, wherein the vaporizer is configured to deliver a precursor gas to a processing region defined between the vaporizer and the substrate support, and a heater disposed adjacent to the vaporizer, wherein the heater is configured to heat the vaporizer.