Method of deep learning-based examination of a semiconductor specimen and system thereof
US11010665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2017 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Nov 18, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/82
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There are provided system and method of segmentation a fabrication process (FP) image obtained in a fabrication of a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained to provide segmentation-related data, processing a fabrication process (FP) sample using the obtained trained DNN and, resulting from the processing, obtaining by the computer segments-related data characterizing the FP image to be segmented, the obtained segments-related data usable for automated examination of the semiconductor specimen. The DNN is trained using a segmentation training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprises a training image; FP sample comprises the FP image to be segmented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.