Polishing pad with window and manufacturing methods thereof

US11072050B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Boyi Fu · San Jose, US
• Sivapackia Ganapathiappan · Palo Alto, US
• Daniel Redfield · معلمی نژاد, US
• Rajeev Bajaj · Fremont, US
• Ashwin CHOCKALINGAM · San Jose, US
• Dominic J. Benvegnu · La Honda, US
• Mario CORNEJO · San Jose, US
• Mayu YAMAMURA · San Mateo, US
• Nag B. Patibandla · Pleasanton, US
• Ankit Vora · San Jose, US

Key dates

• Filing date: Jul 31, 2018
• Grant date: Jul 27, 2021
• Expiry date: Oct 24, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/26
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.