Method to predict yield of a device manufacturing process
US11086229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2018 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Mar 29, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/706841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.