Method and apparatus for post exposure processing of photoresist wafers

US11112697B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Viachslav Babayan · Sunnyvale, US
• Douglas A. Buchberger, Jr. · Livermore, US
• Qiwei Liang · Fremont, US
• Ludovic Godet · Sunnyvale, US
• Srinivas D. Nemani · Sunnyvale, US
• Daniel J. Woodruff · Kalispell, US
• Randy Harris · Kalispell, US
• Robert B. Moore · Bigfork, US

Key dates

• Filing date: Feb 11, 2019
• Grant date: Sep 7, 2021
• Expiry date: Jul 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68764
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.