Patent · US Active

System for cleaning semiconductor wafers

US11141762B2 · kind B2 · utility

2Cited by

10References

42Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Hui Wang · Shanghai, CN
Fufa Chen · Cupertino, US
Fuping Chen · Shanghai, CN
Jian Wang · Rosharon, US
Xi Wang · Shanghai, CN
Xiaoyan Zhang · Shanghai, CN
Yinuo Jin · Shanghai, CN
Zhaowei Jia · Shanghai, CN
Liangzhi Xie · Shanghai, CN
Jun Wang · Nanhu, CN
Xuejun Li · Shanghai, CN

Key dates

Filing date	Nov 15, 2017
Grant date	Oct 12, 2021
Priority date	—
Expiry date	Jul 15, 2038

Classification

Technology area (CPC G)Physics
CPC primaryG08B25/08
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.