Method of deep learning-based examination of a semiconductor specimen and system thereof
US11205119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2016 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Dec 8, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/82
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more FP images. The examination-related application can be, for example, classifying at least one defect presented by at least one FP image, segmenting the at least one FP image, detecting defects in the specimen presented by the at least one FP image, registering between at least two FP images, regression application enabling reconstructing the at least one FP image in correspondence with different examination modality, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.