Method of deep learning-based examination of a semiconductor specimen and system thereof
US11348001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2017 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Oct 2, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/82
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There are provided system and method of classifying defects in a semiconductor specimen. The method comprises: upon obtaining by a computer a Deep Neural Network (DNN) trained to provide classification-related attributes enabling minimal defect classification error, processing a fabrication process (FP) sample using the obtained trained DNN; and, resulting from the processing, obtaining by the computer classification-related attributes characterizing the at least one defect to be classified, thereby enabling automated classification, in accordance with the obtained classification-related attributes, of the at least one defect presented in the FP image. The DNN is trained using a classification training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprising a training image presenting at least one defect and the ground truth data is informative of classes and/or class distribution of defects presented in the respective first training samples; the FP sample comprises a FP image presenting at least one defect to be classified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.